1. BS EN 62047-14:2012. Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

2. BS EN 62047-15:2015. Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass

3. BS EN 62047-16:2015. Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

4. BS EN 62047-17:2015. Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

5. BS EN 62047-18:2013. Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

6. BS EN 62047-19:2013. Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses

7. BS EN 62047-20:2014. Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes

8. BS EN 62047-21:2014. Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson’s ratio of thin film MEMS materials

9. BS EN 62047-22:2014. Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

10. BS EN 62047-26:2016. Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures