1. CEI/IEC 60191-2. Amendment 9. Mechanical standardization of semiconductor devices – Part 2: Dimensions

2. CEI/IEC 60191-2. Mechanical standardization of semiconductor devices – Part 2 Dimensions

3. CEI/IEC 60191-2W:1999. Mechanical standardization of semiconductor devices – Part 2: Dimensions

4. CEI/IEC 60191-2X:1999. Mechanical standardization of semiconductor devices – Part 2: Dimensions

5. CEI/IEC 60191-2Y:1996. Mechanical standardization of semiconductor devices – Part 2: Dimensions

6. CEI/IEC 60191-2Z:2000. Mechanical standardization of semiconductor devices – Part 2: Dimensions

7. CEI/IEC 60191-3:1999. Mechanical standardization of semiconductor devices – Part 3: General rules for the preparation of outline drawings of integrated circuits

8. CEI/IEC 60191-5:1997. Mechanical standardization of semiconductor devices – Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

9. CEI/IEC 71-2:1996. Insulation co-ordination – Part 2: Application guide

10. CEI/IEC 60191-2T:1996. Mechanical standardization of semiconductor devices - Part 2: Dimensions