1. IEC 60189-2:2007. Low-frequency cables and wires with PVC insulation and PVC sheath – Part 2: Cables in pairs, triples, quads and quintuples for inside installations

2. IEC 60191-1:2007. Mechanical standardization of semiconductor devices – Part 1: General rules for the preparation of outline drawings of discrete devices

3. IEC 60191-2X-1999. IEC Publication 60191-2X (First edition -1999). Mechanical standardization of semiconductor devices – Part 2: Dimensions

4. IEC 60191-4:2013. Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

5. IEC 60191-6-1:2001. Mechanical standardization of semiconductor devices – Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

6. IEC 60191-6-10:2003. Mechanical standardization of semiconductor devices – Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

7. IEC 60191-6-12:2011. Mechanical standardization of semiconductor devices – Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

8. IEC 60191-6-13:2007. Mechanical standardization of semiconductor devices – Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array

9. IEC 60191-6-16:2007. Mechanical standardization of semiconductor devices – Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

10. IEC 60191-6-18 (First edition – 2010) MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor