1. IEC 60191-6-1862010. Mechanical standardization of semiconductor devices – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

2. IEC 60191-6-19:2010. Mechanical standardization of semiconductor devices – Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

3. IEC 60191-6-2 (First edition – 2001). Mechanical standardization of semiconductor devices – Part 6-2

4. IEC 60191-6-2:2001. Mechanical standardization of semiconductor devices – Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

5. IEC 60191-6-20:2010. Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

6. IEC 60191-6:2009. Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

7. IEC 60191-6-21:2010. Mechanical standardization of semiconductor devices – Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

8. IEC 60191-6-22:2012. Mechanical standardization of semiconductor devices – Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

9. IEC 60191-6-3:2000. Mechanical standardization of semiconductor devices – Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

10. IEC 60191-6-4:2003. Mechanical standardization of semiconductor devices – Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages