1. IEC 60191-6-5:2001. Mechanical standardization of semiconductor devices – Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

2. IEC 60191-6-6:2001. Mechanical standardization of semiconductor devices – Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

3. IEC 60191-6-8:2001. Mechanical standardization of semiconductor devices – Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

4. IEC/PAS 60099-7:2004. Surge arresters – Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331

5. IEC/TR 60068-3-12:2014. Environmental testing – Part 3-12: Supporting documentation and guidance – Method to evaluate a possible lead-free solder reflow temperature profile

6. IEC/TS 60110-2:2000. Power capacitors for induction heating installations – Part 2: Ageing test, destruction test and requirements for disconnecting internal fuses

7. IEC 60189-3:2007. Low-frequency cables and wires with PVC insulation and PVC sheath – Part 3: Equipment wires with solid or stranded conductor wires, PVC insulated, in singles, pairs and triples

8. IEC 60191-6-17:2011. Mechanical standardization of semiconductor devices – Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

9. CEI/IEC 60027-1:1992. Amendment 1. Letter symbols to be used in electrical technology - Part 1: General

10. CEI/IEC 60027-1:1992. Amendment 2. Letter symbols to be used in electrical technology - Part 1: General